CERN: Bump bonding of front-end ASICS onto planar silicon pixel sensors
MARKET SURVEY scheduled for dispatch during the fourth quarter 2017. INVITATION TO TENDER is scheduled to dispatch during the first quarter 2019. Firms are welcome to express their interest by sending an e-mail to: firstname.lastname@example.org. CERN publication date: 2017-09-27.
CERN intends to place a contract for the supply of the bump bonding of front-end ASICS onto planar silicon pixel sensors (~10’000 pixel modules in total) for ATLAS ITk Phase II upgrade. The supply will include separate lots: under bump metallization; Bump bonding and Flip chip. Interested firms shall have a proven competence, experience and adequate production capacity in the field(s) of under bump metallization, bump bonding and / or flip chip of sensor modules. Technical questions: P. Morettini Paolo.Morettini@cern.ch Commercial questions: C. Carayon email@example.com
Interested firms are also welcome to contact Research Match for further information. We offer MATCH-RING for monitoring your business possibilities as well as complete bid production and contract audit.